积层陶瓷电感 (mlci) |
mlci 应注意事项
storage
1. the chip inductor shall be packaged in carrier tapes.
2. to keep storage place temperature from 5 to 35℃, humidity from 45 to
70% rh.
3. the storage atmosphere must be free of gas containing sulfur and
chlorine. also, avoid exposing the product to saline moisture. if the
product is exposed to such atmospheres,
the terminals will oxidize and
solderability will be affected.
4. the solderability is assured for 12 months from our final inspection
date if the above storage condition is followed.
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handling
chip inductor should be handled with care to avoid contamination or damage. the use of vacuum pick-up or plastic tweezers is recommended for manual placement. tape and reeled packages are suitable for automatic pick and placement machine. |
soldering profile for smt process with snpb solder patste.
the rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preferred.ceramic chip components should be preheated to within 100 to 130℃ of the soldering.
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soldering profile for smt process with lead free solder paste
the rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preferred.ceramic chip components should be preheated to within 100 to 130℃ of the soldering.
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recommended pad dimensions
| size |
l x w |
a |
b |
c |
| 0603(0201) |
0.6 x 0.3 |
0.15 to 0.35 |
0.2 to 0.3 |
0.25 to 0.3 |
| 1005(0402) |
1.0 x 0.5 |
0.3 to 0.5 |
0.35 to 0.45 |
0.4 to 0.5 |
| 1608(0603) |
1.6 x 0.8 |
0.7 to 1.0 |
0.6 to 0.8 |
0.7 to 0.8 |
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